Advanced Materials & Printed Electronics

Tuesday, 22.11.2016 – Tuesday, 22.11.2016, APAC Innovation Summit Series

Conference

Flyer

Featuring keynote speakers from both industry and research community, this will be a forward-looking sharing session which identifies new challenges and trends of advanced materials & printed electronics.

Conference Highlights:

(i)   Printed electronics applications with advanced materials including printed dielectric, conductors, graphene, etc.;
(ii)  Smart packaging, printed battery, printed memory, printed sensors and flexible displays;
(iii) Latest market trends, industry drivers and development of printed devices;
(iv) Business matching with printed electronics companies, materials suppliers, R&D institutes and users.

Please register here.

For more details please visit here.

Location: Charles K. Kao Auditorium, Hong Kong Science and Technology Park, Shatin, Hong Kong